Zirconia Ceramic Wafer Carriers And Cleaning Jigs: Precision Support Solutions For Semiconductor And Photovoltaic Industries
Introduction
Zirconia ceramic wafer carriers and cleaning jigs are high-precision auxiliary tools specifically designed for semiconductor wafer manufacturing and photovoltaic silicon processing. Manufactured from high-purity, nano-grade zirconia (ZrO₂) through phase transformation toughening technology and precision machining, they exhibit exceptional dimensional stability, excellent chemical corrosion resistance, and outstanding mechanical strength. These components operate reliably in high-temperature, highly corrosive, and ultra-clean environments, ensuring zero contamination and zero damage support for wafers and silicon sheets during manufacturing processes.
Applications
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Semiconductor Wafer Manufacturing: Diffusion process boats, CVD trays, etching fixtures, ion implantation carriers
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Photovoltaic Silicon Processing: Cleaning baskets, texturing supports, PECVD trays, screen printing positioning jigs
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Display Panel Manufacturing: OLED evaporation mask supports, glass substrate transfer arms
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Precision Testing Equipment: Probe station chucks, microscope stages, thickness measurement tooling
Advantages
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Ultra-High Dimensional Stability: Thermal expansion coefficient close to silicon (4.2×10⁻⁶/K), ensuring no displacement deviation during high-temperature processes
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Excellent Chemical Resistance: Resists corrosion from all semiconductor-grade chemicals including HF, HNO₃, and KOH
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Extremely Low Contamination Risk: Metal ion release <0.1ppb, meeting Class 10 cleanroom requirements
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Exceptional Wear Life: Hardness >1300HV, service life exceeds PEEK materials by more than 10 times
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Multi-functional Integration: Can incorporate special functional requirements such as conductivity, insulation, and magnetism
Specification Parameter Table
Nanoscale powder synthesis → Stabilizer doping → Spray granulation → Isostatic pressing → Pre-sintering → Five-axis precision machining → High-temperature sintering → Precision grinding → CMP polishing → Ultrasonic cleaning → Cleanroom packaging
Usage Instructions
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Requires plasma cleaning in a cleanroom before use to remove packaging contaminants
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Regular particle testing recommended for silicon contact areas (every 50 cycles)
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Avoid direct contact with hard tools; use dedicated ceramic tweezers for handling
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Store in ISO Class 4 or higher clean environments
After-Sales Service
Cleanroom unpacking guidance, usage training, free particle testing service, 12-month warranty period, emergency replacement support, and custom modification services
FAQ
Q1: What advantages do zirconia carriers offer over silicon carbide carriers?
A: Lower metal ion release risk (by one order of magnitude) and no silicon vapor contamination
Q2: Is RFID embedding integration supported?
A: Yes, high-temperature resistant RFID tags can be embedded, withstanding up to 800℃ process temperatures
Q3: How to perform daily maintenance?
A: Recommend O₃+H₂O₂ mixed cleaning every 50 uses and SPM deep cleaning every 200 uses
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